Follow us:

Capabilities Statement
Relteck Brochure
D-U-N-S Registered

Camera Cell Phone Thermal & Mechanical Environmental Stress Reliability Testing for Major Contact manufacture in Silicon Valley

Client:

Confidential
(Leading camera cell phone contract manufacturer based in Silicon Valley)

  • Thermal cycling under extreme conditions
  • Shock and drop reliability testing
  • Random vibration exposure analysis
  • Temperature and humidity stress testing
  • Functional go/no-go reliability validation
camera-cell-phone-contract-manufacturer

Objective:

To conduct a comprehensive series of environmental and mechanical stress tests, including thermal cycling, shock, drop, vibration, temperature, and humidity assessments, to validate the reliability of newly designed camera cell phone models. The goal was to identify potential early failures, confirm long-term durability, and ensure the delivery of a reliable design for use by major cell phone manufacturers worldwide.

The Challenge:

The client was preparing to launch a newly designed camera cell phone that needed to perform reliably in tough conditions. These devices would face constant vibration and high temperatures, making early failures or design flaws unacceptable. The challenge was clear: test the design under extreme stress to uncover weak points, predict potential breakdowns, and confirm the phone’s durability over the long term.

Relteck’s Solution:

  • Developed a reliability test plan tailored to the new camera cell phone design, focused on spotting early failures, design flaws, and long-term durability risks.
  • Ran a series of functional go/no-go tests along with thermal and mechanical stress tests, including thermal cycling, temperature and humidity exposure, shock, random vibration, and drop testing under real-world user conditions.
  • Modeled the impact of environmental stresses such as thermal cycling, vibration, and humidity to mirror the conditions the devices would face in daily use.
  • Predicted failure rates, MTBF, product lifespan, and potential failure zones using data gathered from laboratory reliability tests.
  • Recommended design reinforcements, component substitutions, and improvements to strengthen the product against identified risks.
  • Collaborated closely with the client’s electrical and mechanical engineering teams, as well as their contract manufacturing partners, to apply and refine these reliability tests throughout the design process.

Results:

  • Flagged five critical failure risks during the prototype phase, preventing costly issues later in production.
  • Extended expected product lifespan by 2.5 times.
  • Boosted confidence in large-scale field deployment.
  • Cut back on the need for design changes and post-deployment fixes.
  • Delivered reports in the client’s format, complete with graphs, dashboards, and clear risk markers.
  • Made risk indicators easy to understand for both technical and non-technical stakeholders.
  • Helped the client’s team move faster on design validation decisions.

Keep your tech infrastructure ahead of the curve!

Relteck’s offers MTBF prediction, PCB Sherlock simulation,
reliability consulting, and testing services. For more information,
contact sales or visit their Los Angeles or Fremont offices.