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Capabilities Statement
Relteck Brochure
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System-Level MTBF Analysis for an Aerospace Avionics Module

aerospace-avionics-manufacturer

Client:

Confidential(Aerospace Avionics Manufacturer)

An aerospace electronics supplier needed to confirm that its new avionics module could perform reliably in extreme flight conditions. The system had to survive heat, vibration, and long hours of continuous operation. To meet these demands, Relteck ran a full MIL-HDBK-217–based MTBF analysis and applied component derating across critical circuits.

The result was a 38% improvement in predicted MTBF analysis. A 24% drop in component stress, and a more stable mission reliability profile for the client’s next-gen aircraft systems. Similar optimization approaches were also applied in our MTBF prediction for automotive systems case study. Showcasing consistent reliability gains across industries.

Objective:

Build a data-driven reliability model and derating plan that could prove the module’s readiness for aerospace conditions and help extend its service life.

The Challenge:

During environmental and thermal cycling tests, the avionics module began showing intermittent failures. Several electronic parts were operating close to their rated limits, which made them vulnerable during long missions. The team didn’t have a clear reliability baseline. Without a standard model like MIL-HDBK-217 or a structured derating policy, it was hard to see which parts were the real risk. They needed a way to predict performance under stress and pinpoint weak links before production.

Relteck’s Solution:

Relteck approached the problem with a mix of reliability modeling, stress testing, and risk analysis that tied everything together.

  • Applied MIL-HDBK-217F Notice 2 to predict failure rates and calculate system-level MTBF.
  • Ran a full component derating review across power, control, and signal circuits to spot overstressed components.
  • Used RBD modeling and simulation to map subsystem dependencies and highlight single-point vulnerabilities.
  • Performed FMEA and FMECA analysis to rank risks and identify failure contributors.
  • Cross-checked results using prior Reliability Sherlock modeling to verify thermal and vibration fatigue patterns.
  • Delivered a detailed report and Excel model showing MTBF data, derating results, and clear design adjustments.

Results:

  • Predicted MTBF increased by 38% across avionics control and power sections.
  • Component stress reduced by 24%, improving long-term durability.
  • Mission reliability reached 98.5% under simulated MIL-HDBK-217 conditions.
  • The new model became a reusable reliability framework for future aerospace and defense programs.
  • Set the stage for deeper environmental stress analysis for electronics and qualification under MIL-STD-810 standards.

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Relteck’s offers MTBF prediction, PCB Sherlock simulation,
reliability consulting, and testing services. For more information,
contact sales or visit their Los Angeles or Fremont offices.